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1. Equipment Size : 5500mm x 2730mm x 2260mm
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2. Wafer Size : 156mm x 156mm ~ 230mm x 230mm , Thickness:140~220μm
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3. Double-line Productivity : M10≥8500PCS/H ; M12 ≥7200PCS/H(Compatible with 230 sources at the same time)
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4. Breakage Rate ≤ 0.05%(Except for incoming cracks)
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5. Uptime ≥ 98%
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6. Laser Wavelength : 532nm
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7. Laser Frequency < 2000Khz
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8. Laser Power : 30w~55W
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9. Power Stability < 2% RMS
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10. Laser Lifetime ≥ 50000小时
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11. Scan Mode : Galvanometer scanning
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12. Spot Size : 35um±5um(Adjustable in size)
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13. Scanning Speed ≥ 35m/s
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14. Graphic Marking Accuracy ≤ ±15μm
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15. Loading Breakage Detection : 12 million pixels (general),Edge collapse and corner missing can be detected
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16. Graphics Compatibility : Compatible with plt, dxf, dwg graphics formats(Compatible with points, lines and segments)
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17. Dust Removal and Filtration Efficiency : Dust removal ≥95%, filtration ≥99%,(Independent dust removal equipment, exhaust air volume max2000m3/h)
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