大奖国际

MX-SSG1A Wafer back grinding equipment
The equipment is applied in grinding semiconductor wafers of various materials，with advanced operation and management system to improve the production efficiency.
Equipment Advantage
  • 01
    Equipped with material information scanning and input system
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    Equipped wtith wafer level handling robot
  • 03
    Equipped with Fool-proofing system to identify the positive and negative side of the wafer
  • 04
    Equipped with water ring vacuum pump to ensure the stable vacuum and the small vibration
  • 05
    Equipped With a visual management system for the grinding process
  • 06
    Equipped with customized ultra-precision chuck table base，excellent performance, small vibration, that can adapt to different hardness of wafer materials
Equipment Picture
Basic Parameters
  • 1. Applicable Products：Si wafer，glass，metal plating
  • 2. Processing method：full-automatic
  • 3. Applicable wafer size: 100mm-200mm
  • 4. Final product thickness：80μm
  • 5. Grinding speed：0.1μm-50mm/s
  • 6. Z-axis minimum stroke：120mm
  • 7. Applicable material thickness：≤1800μm
  • 8. TTV：≤2.5μm，WTW≤2.5μm，Ra≤0.02μm
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